Electronics

The core advantages of epoxy resin in electronics are high insulation properties and heat resistance. It offers a high Comparative Tracking Index and long-term temperature resistance up to 150°C, meeting the requirements of copper-clad laminates and encapsulation materials.

Cure shrinkage is below 2%, which minimizes stress on sensitive components. The material is moisture-resistant and can pass UL94 V-0 flame retardancy certification, making it suitable for harsh environments such as automotive electronics and outdoor base stations.

Viscosity can be adjusted to suit different processes, including dispensing, potting, and vacuum impregnation.

Typical products include copper-clad laminates (FR-4), semiconductor encapsulation materials, and potting compounds for inductors and capacitors.